I'm continually amazed by Samsung's rise to power in the SSD space. If you compare their market dominating products today to what we were reviewing from Samsung just a few years ago you'd assume they came from a different company. The past three generations of Samsung consumer SSDs have been good, but if you focus exclusively on the past two generations (
830/840) they've been
really good.
Last year Samsung bifurcated its consumer SSD lineup by intoducing the
840 Pro in addition to the vanilla
840. We'd seen other companies explore a similar strategy, but usually by playing with synchronous vs asynchronous NAND or sometimes just using different NAND suppliers between lines. Samsung used NAND to differentiate the two but went even more extreme. The non-Pro version of the 840 was the first large scale consumer SSD made with 3-bit-per-cell MLC NAND, more
commonly known as TLC (triple-level-cell) NAND. Companies had toyed with the idea of going TLC well before the 840's release but were usually stopped either by economic or endurance realities. The 840 changed all of that. Although it didn't come with tremendous cost savings initially, over time the Samsung SSD 840 proved to be one of the better values on the market - you'd just have to get over the worry of wearing out TLC NAND.
Despite having a far more limited lifespan compared to its 2bpc MLC brethren, the TLC NAND Samsung used in its 840 turned out to be quite reliable. Even our own aggressive estimates pegged typical client write endurance on the 840 at more than 11 years for the 128GB model.
Samsung 19nm TLC NAND
We haven't seen Samsung's love of TLC embraced by other manufacturers. The most significant contrast actually comes from Micron, another NAND supplier turned SSD manufacturer, and its
M500. Relying on 2bpc MLC NAND, the M500 gets its cost down by using a combination of large page/block sizes (to reduce overall die area) as well as aggressively embracing the latest NAND manufacturing processes (in this case 20nm). That's always been the Intel/Micron way - spend all of your time getting to the next process node quickly, and drive down cost that way rather than going TLC. The benefit of the TLC approach is the potential for even more cost reduction, but the downside is it usually takes a while to get production to yield high enough endurance TLC to make it viable for use in SSDs. The question of which is quicker is pretty simple to answer. If we look at the 25nm and 20nm generations from IMFT, the manufacturer was able to get down to new process nodes quicker than Samsung could ship TLC in volume.
The discussion then shifts to whether or not TLC makes sense at that point, or if you'd be better off just transitioning to the next process node on MLC. Samsung clearly believes its mainstream TLC/high-end MLC split makes a lot of sense, and seeing how the 840 turned out last time I tend to agree. It's not the only solution, but given how supply constrained everyone is on the latest NAND processes this generation - any good solution to get more die per wafer is going to be well received. Samsung doesn't disclose die areas of its NAND, so we unfortunately can't tell just how much more area efficient its TLC approach is compared to IMFT's 128Gb/16K page area efficient 20nm MLC NAND.
As with any other business in the tech industry, it turns out that a regular, predictable release cadence is a great way to build marketshare. Here we are, around 9 months after the release of the Samsung SSD 840 and we have its first successor: the 840 EVO.
As its name implies, Samsung's SSD 840 EVO is an evolution over last year's SSD 840. The EVO still uses 3-bit-per-cell TLC NAND, but it moves to a smaller process geometry. Samsung calls its latest NAND process 10nm-class or 1x-nm, which can refer to feature sizes anywhere from 10nm to 19nm but we've also heard it referred to as 19nm TLC. The new 19nm TLC is available in capacities of up to 128Gbit per die, like IMFT's latest 20nm MLC process. Unlike IMFT's 128Gb offering, Samsung remains on a 8KB page size even with this latest generation of NAND. The number of pages per block is also more like IMFT's previous 64Gbit 20nm MLC at 256:
| IMFT vs. Samsung NAND Comparison |
| | IMFT 20nm MLC | IMFT 20nm MLC | Samsung 19nm TLC | Samsung 21nm TLC | Samsung 21nm MLC |
| Bits per Cell | 2 | 2 | 3 | 3 | 2 |
| Single Die Max Capacity | 64Gbit | 128Gbit | 128Gbit | 128Gbit | 64Gbit |
| Page Size | 8KB | 16KB | 8KB | 8KB | 8KB |
| Pages per Block | 256 | 512 | 256 | 192 | 128 |
| Read Page (max) | 100 µs | 115 µs | ? | ? | ? |
| Program Page (typical) | 1300 µs | 1600 µs | ? | ? | ? |
| Erase Block (typical) | 3 ms | 3.8 ms | ? | ? | ? |
| Die Size | 118mm2 | 202mm2 | ? | ? | ? |
| Gbit per mm2 | 0.542 | 0.634 | ? | ? | ? |
| Rated Program/Erase Cycles | 3000 | 3000 | 1000 - 3000 | 1000 - 3000 | 3000 (?) |
The high level specs, at least those Samsung gives us, points to an unwillingness to sacrifice latency even further in order to shrink die area. The decision makes sense since TLC is already expected to have 50% longer program times than 2bpc MLC. IMFT on the other hand has some latency to give up with its MLC NAND, which is why we see the move to 2x larger page and block sizes with its 128Gbit NAND die. Ultimately that's going to be the comparison that's the most interesting - how Samsung's SSD 840 EVO with its 19nm TLC NAND stacks up to Crucial's M500, the first implementation of IMFT's 128Gbit 20nm MLC NAND.
